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篇一：smt常用述誾
SMT常用述語
微組裝技術﹕MPT/Microelectronic Packaging technology
混裝技術﹕Mixed Component Mounting Technology
封裝﹕ Package
貼片﹕Pick and Place
拆焊﹕ Desoldering
再流﹕Reflow
浸焊﹕ Dip Soldering
拖焊﹕ Drag soldering
印制電路﹕Printed Circuit
印制線路﹕ Printed Wiring
印制電路板﹕ printed circuit board
印制線路板﹕printed wiring board
層壓板﹕laminate
覆銅薄層壓板﹕copper-clad laminate
基材﹕base material
